【 中文摘要 】本发明公开了一种可调三维集成电容器，包括多个三维集成电容、多个TSV垂直开关a、多个TSV垂直开关b，相邻两个三维集成电容之间设置一个TSV垂直开关a和一个TSV垂直开关b，每个TSV垂直开关a漏极连接上一个三维集成电容下极板，源极连接下一个三维集成电容上极板，每个TSV垂直开关b源极连接上一个三维集成电容上极板，漏极连接下一个三维集成电容下极板；与二维平面电容器相比，三维集成电容器具有较大的电容密度，较小的对地寄生电容参数；利用TSV垂直开关的栅极电压的变化会引起TSV垂直开关的打开与关断，从而实现对N+1个三维集成电容器是否并联和几个三维集成电容器并联的控制。

【 英文摘要 】The invention discloses an adjustable three-dimensional integrated capacitor. The capacitor comprises a plurality of three-dimensional integrated capacitors, a plurality of TSV vertical switches a anda plurality of TSV vertical switches b; a TSV vertical switch a and a TSV vertical switch b are arranged between two adjacent three-dimensional integrated capacitors; the drain electrode of each TSVvertical switch a is connected with the lower polar plate of the previous three-dimensional integrated capacitor, and the source electrode of each TSV vertical switch a is connected with the upper polar plate of the next three-dimensional integrated capacitor; the source electrode of each TSV vertical switch b is connected with the upper polar plate of the previous three-dimensional integrated capacitor, and the drain electrode is connected with the lower polar plate of the next three-dimensional integrated capacitor. Compared with a two-dimensional planar capacitor, the three-dimensional integrated capacitor has relatively large capacitance density and relatively small parasitic capacitance parameters to the ground; the change of the grid voltage of the TSV vertical switches can cause theswitching-on and switching-off of the TSV vertical switches, thereby achieving the control of whether N + 1 three-dimensional integrated capacitors are connected in parallel or not and the parallel connection of a plurality of three-dimensional integrated capacitors.

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